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28 Layer Type 4 W/Embedded Passives
Special Features: High Layer Count, Blind/Buried (Ohmegaply) Capacitors, Buried Vias, Sequential Laminations, High Density/Fine Line Circuitry, Immersion Gold (ENIG) Finish, 1 & 2 Mil Cores
End Use Application:
F-35 Joint Strike Fighter (JSF) Core Processor
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28 Layer Type 4 W/Bookbinder
Special Features: High Layer Count, Bookbinder (26 Layers), Blind/Buried Vias, Sequential Laminations, Controlled Impedance
End Use Application:
Test Set For M1 A1/A2 Main Battle Tank – Backplane/O Board
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16 Layer Type 4 W/Assembly
Special Features: Multiple Board Assembly, Oversize - 60” Total Length, 360° Silver Ink (EMI) Shielding, Potted/Shielded Connector Terminations, Multiple Overlapping Flex Appendages, Sequential Laminations
End Use Application:
U2 ISR Pod
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16 Layer Type 4 w/Bookbinder
Special Features: 2 180° bookbinders
End Use Application:
F-18 Avionics Display
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Pioneer Circuits is a leading designer, manufacturer and marketer of advanced printed circuit technology. The PCI products illustrate the double-sided, multi-layer, flexible and flex-rigid PWBs for commercial and military electronics avionics and space applications.
PCI's products include individual components as well as complete circuit solutions that enhance customer designs by providing space optimization, reducing size circuits.
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9 Layer Type 4 W/Assembly
Special Features: Heavy (4oz) Copper, Sequential Laminations, Blind/Buried Vias
End Use Application:
Power Bus For Shipboard Phased Array Radar
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8 Layer Type 4
Special Features: Sequential Laminations, Multiple Thickness Rigid Sections, Controlled Impedance
End Use Application:
NASA/JPL Mars Exploration Rovers (MER 03) - Camera Electronics Board
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30 Layer Type 4
Special Features: Sequential Laminations, Oversize (~28” length)
End Use Application:
NASA/JPL Mars Pathfinder ‘Sojourner’ Rover – Main Interconnect Harness
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1 Layer Type 1
Special Features: Oversize (approx 120”)
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3 Layer Type 5 w/Assembly
Special Features: direct termination of shield/ground layers to connector body, no plated thru holes, Nano-D high density connectors
End Use Application:
Communications Satellite Phased Array Antenna – Jumper Flex
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