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• Adhesiveless constructions are strongly recommended for all rigid-flex design
  
  
• Thin core constructions Z-axis thickness of rigid or flex/rigid-flex PWB’s can be minimized using 1 and 2 mil core laminates
  
  
• Flexible Silver Ink is an alternate material to achieve EMI/RFI shielding on flex circuits while maintaining high flexibility
  
  
• Bookbinder technology can be employed to achieve a tight bend radius with multiple flex layers
  
  
• Constantan is a nickel-copper alloy with properties that make it useful as a replacement for copper when heat load or thermal management are major concerns