Capability Overview

With over four decades of industry experience Pioneer Circuits is a premiere PBC manufacturer, offering an extensive range of high quality PCB services tailored to your requirements.

Form Factor

Form Factor Width Length Base Materials
Flex Circuitry 22" 80" Polyimide, Copper, Gold
Rigid-Flex Circuitry 22" 34" (Confined Rigids), 80" (Cable) FR4, Polyimide, Copper, Gold
Rigid Circuitry 22" 34" FR4, Polyimide, Copper, Gold

Engineering

Service Capabilities Comments
Mockups
  • 3D Printing
  • CNC Machining
  • Rapid Prototyping
  • Non-Funtional Mockups

Mock-ups are typically completed within 1-2 weeks depending on the amount of special features requested.
Technical Training
  • PCB Design Fundamentals
  • PCB Design for Manufacturability (DFM)
  • PCB Manufacturing Processes
  • PCB Testing and Inspection
  • PCB Troubleshooting

Seminars are free of charge and are held on site at Pioneer.
Manufacturability Review
  • DRC's (Design Rule Check)
  • Cost analysis
  • Bill of Materials (BOM) Generation
  • Assembly Recommendations

Save time by getting experienced advice on what is most suitable for your project.

Manufacturing

Feature Capabilities Comments
Layer Count 1-40+
Vias
  • Blind Vias
  • Buried Vias
  • Filled/Capped Vias
  • Copper-Filled Microvias
  • Via Backdrilling

Vias allow electrical signals and power to be routed between different layers. This helps to increase routing density, reduces board size, and enhances thermal management.
Bonding
  • Adhesive
  • Adhesiveless

Adhesiveless options are available for flex and rigid-flex.
Controlled Impedance
  • Cross Hatched Impedance Calculations
  • Ground Planes
  • Single and Differential Pairs

To measure the impedance of a trace over a cross-hatched ground plane, it's necessary to use a specialized impedance analyzer. This analyzer is designed to compensate for the effects of the cross-hatched pattern and provide accurate impedance measurements.
Thermal Management

    Design

  • Laser Drilling
  • Microvias
  • Copper Pours
  • Heat Sinks

    Alloys

  • Constantan

The techniques that are used will depend on the specific application. For example, a high-performance circuit board that generates a lot of heat may require a combination of heat sinks and thermal vias. A low-power circuit board may only require a simple heat sink.
EMI Shielding

    Techniques

  • PCB Shielding
  • Component Shielding
  • Shielded Flex

    Materials

  • Sputter Gold
  • Silver Paste
  • Copper Paste
  • Resistivity Paste

EMI shielding materials, such as metal and conductive polymers, can be used to create a barrier that blocks EMI signals.

Assembly

Service Capabilities Comments
Surface mount technology (SMT)
  • Component Placement
  • Solder Paste
  • Reflow Soldering
  • Potting
  • Conformal Coating
 Compliant and certified J-STD-001 Class 3 and Space Addendum.
Through-hole technology (THT)
  • Component Placement
  • Hand Soldering
  • Wave Solder Process
  • Potting
  • Conformal Coating
 Compliant and certified J-STD-001 Class 3 and Space Addendum.
3D Printing
  • Rapid Prototyping
  • Custom Design
  • Post-processing

Customized fixture, hardware protection.
PCB testing
  • Visual Inspection
  • In-circuit Testing and Programming (Continuity and Resistance)
  • AOI
  • X-Ray Insepction on Hidden Solder Joints.
  • Environmental Testing (Thermal Cycling)

Inspection per J-STD-001 Class3 , Sapce Addendum and IPC-A-610
Have Questions?
Find out more on how our team can help you.
Get Quote